光电子封装中新型激光焊接吸收薄膜的设计

江绍基; 李伟多; 金涛; 汪河洲

红外与激光工程, 2005, 34 (5): 505, 网络出版: 2006-05-25

光电子封装中新型激光焊接吸收薄膜的设计

Design of novel absorptive thin film for laser welding in optoelectronic device capsulation

论文大纲

江绍基李伟多金涛汪河洲

作者单位

中山大学,光电子技术与材料国家重点实验室,广东,广州,510275

吸收薄膜激光焊接光波导光学器件 Absorptive thin films Laser welding Wave-guide Optical components MEMS MEMS

摘要

设计了一种用于对SiO2、Si和LiNbO3等材料进行激光焊接的吸收薄膜.这种"金属-介质-金属"的三层吸收薄膜减少了夹在透明母料之间的焊料表面对Nd:YAG激光束的反射.该设计使激光能量在实验中的实际吸收率超过99%.这种吸收膜与焊料层的结合使激光能更有效地转化为热能,减少了激光穿透母料的能量.这样也就减少了因为激光的透射而导致母料损伤的可能性,使激光能量得到更有效的利用.同时,焊接成品的力学性能也得到了有效提高.

Abstract

A kind of absorptive thin film was designed and used in laser welding of SiO2, Si and LiNbO3. This absorptive thin film of three layer metal-dielectric-metal structure is designed for further reducing the high reflectance of the Nd：YAG laser beam on the surface of the thin layer that is utilized as solder between the transparent parent materials. The actual absorption of laser energy in experiment exceeds 99%. This combination of absorber and solder transformed the laser energy into heat efficiently and decreased the minimum necessary incident laser power transmitting through the transparent parent materials. As a result, the damage of the parent materials, which is suffered from laser transmission, was avoided; On the other hand, mechanical stability of the welded materials had been improved. Experiment shows the difference between welding with and without the absorptive thin film.[

参考文献

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江绍基, 李伟多, 金涛, 汪河洲. 光电子封装中新型激光焊接吸收薄膜的设计[J]. 红外与激光工程, 2005, 34(5): 505. 江绍基, 李伟多, 金涛, 汪河洲. Design of novel absorptive thin film for laser welding in optoelectronic device capsulation[J]. Infrared and Laser Engineering, 2005, 34(5): 505.

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