发光学报, 2019, 40 (5): 616, 网络出版: 2019-06-10  

等温等效替代热压印法成型超薄导光板的工艺分析

Analyses on Forming Process of Ultrathin Light Guide Plate by Isothermal Equivalent Substitution Hot Embossing
作者单位
北京化工大学 机电工程学院, 高分子材料加工装备教育部工程研究中心, 北京 100029
引用该论文

李楷, 吴大鸣, 刘颖, 曹亚楠, 许红, 赵中里, 孙靖尧. 等温等效替代热压印法成型超薄导光板的工艺分析[J]. 发光学报, 2019, 40(5): 616.

LI Kai, WU Da-ming, LIU Ying, CAO Ya-nan, XU Hong, ZHAO Zhong-li, SUN Jing-yao. Analyses on Forming Process of Ultrathin Light Guide Plate by Isothermal Equivalent Substitution Hot Embossing[J]. Chinese Journal of Luminescence, 2019, 40(5): 616.

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李楷, 吴大鸣, 刘颖, 曹亚楠, 许红, 赵中里, 孙靖尧. 等温等效替代热压印法成型超薄导光板的工艺分析[J]. 发光学报, 2019, 40(5): 616. LI Kai, WU Da-ming, LIU Ying, CAO Ya-nan, XU Hong, ZHAO Zhong-li, SUN Jing-yao. Analyses on Forming Process of Ultrathin Light Guide Plate by Isothermal Equivalent Substitution Hot Embossing[J]. Chinese Journal of Luminescence, 2019, 40(5): 616.

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