[1] Lu Tianjian, Jin Jianming. Coupled electrical-thermal-mechanical simulation for the reliability analysis of large-scale 3-D interconnects[J]. IEEE Transactions on Components Packaging & Manufacturing Technology, 2017, 7(2): 229-237.

[2] 赵振国, 周海京, 马弘舸, 等. PIN限幅器电磁脉冲效应数值模拟与验证[J]. 强激光与粒子束, 2014, 26: 063018. (Zhao Zhenguo, Zhou Haijing, Ma Hongge, et al. Numerical simulation and verification of electromagnetic pulse effect of PIN diode limiter. High Power Laser and Particle Beams, 2014, 26: 063018)

[3] Tong Jie, Zhu Guodong, Hu Jun, et al. Study on electro-thermo-mechanical responses of bonding wires arrays used for the package design of LDMOSFET-based RF amplifier[C]//IEEE Electrical Design of Advanced Packaging and Systems. 2017: 211-213.

[4] Zhou Wei, Zhou Liang, Lin Liang, et al. Electro-thermal-stress interactions of LDMOS FET induced by DCI RF-pulses[J]. IEEE Transactions on Electromagnetic Compatibility, 2014, 56(5): 1178-1184.

[5] Sandia National Laboratories. Engineering Physics Integrated Codes\[EB/OL\]. http: //www. sandia. gov/asc/integrated_codes. html

[6] Liu Qingkai, Zhao Weibo, Cheng Jie, et al. A programming framework for large scale numerical simulations on unstructured mesh[C]// Proceedings of the 2nd IEEE International Conference on High Performance and Smart Computing (IEEE HPSC). 2016.

[7] Tong Jie, Zhu Guodong, Hu Jun, et al. Study on electro-thermo-mechanical responses of bonding wires arrays used for the package design of LDMOSFET-based RF amplifier[C]//IEEE Electrical Design of Advanced Packaging and Systems. 2017: 211-213.

[8] Kong Fanzhi, Yin Wenyan, Mao Junfa, et al. Electro-thermo-mechanical characterizations of various wire bonding interconnects illuminated by an electromagnetic pulse[J]. IEEE Transactions on Advanced Packaging, 2010, 33(3): 729-737.

[9] 林良. 高性能射频半导体功率器件设计及其在无线通信中的应用研究[D]. 上海: 上海交通大学, 2016. (Lin Liang. Design of high performance RF semiconductor power device and its application in wireless communication. Shanghai: Shanghai Jiaotong University, 2016)