[1] Shiffler D, Cauffman S R, Cross A W. The fourteenth special issue on high power microwave generation［J］. IEEE Trans Plasma Science, 2012,40(6):1493-1494.

[2] 刘敏,刘小龙,晏峰,等.小型L波段高功率微波辐射场测量系统接收天线［J］.强激光与粒子束, 2015, 27:043002.(Liu Min, Liu Xiaolong, Yan Feng, et al. Design of miniaturized high power microwave radiation-field measuring antenna at L-band. High Power Laser and Particle Beams, 2015, 27:043002)

[3] 晏峰,李治国,蒋廷勇,等.X波段高功率微波等效辐射功率测量系统［C］//第三届电磁环境效应与防护技术学术研讨会. 2012:346-349.(Yan Feng, Li Zhiguo, Jiang Tingyong, et al. Measurement system on high power microwave equivalent isotropic radiated power at X-band//The 3rd National Conference on Environment Effects and Protections. 2012:346-349)

[4] 张黎军,陈昌华,滕雁,等.高功率微波辐射场测量方法［J］.强激光与粒子束, 2016, 28:053002.(Zhang Lijun, Chen Changhua, Teng Yan, et al. Far field measurement method of high power microwave in radiation field. High Power Laser and Particle Beams, 2016, 28:053002)

[5] 刘顺坤,聂鑫,陈向跃,等.电磁脉冲辐射场试验中的光纤传输测量系统［J］.核电子学与探测技术, 2010, 30(3):370-373.(Liu Shunkun, Nie Xin, Chen Xiangyue, et al. Electromagnetic pulse measurement system based on optical fiber transmission under radiated wave test. Nuclear Electrics and Detection Technology, 2010,30(3):370-373)

[6] 柯兴利.某型弹载数据采集系统的设计与实现［D］. 湘潭:湘潭大学, 2016:6-14.(Ke Xingli. Design and implementation of certain onboard data acquisition system. Xiangtan: Xiangtan University, 2016:6-14)

[7] 丁晓东.电子设备的电磁兼容性设计［J］.环境技术, 2007, 2(1):33-38.(Ding Xiaodong. Electromagnetic compatibility design of electronic equipment. Environmental Technology, 2017, 2(1):33-38)

[8] Benchtop performance in a pocket-sized scope［EB/OL］. http://www.picotech.com.

[9] 陈宇,舒挺,张军,等.微波脉宽对检波器性能影响的实验研究［J］.强激光与粒子束, 2006, 18(5):876-880.(Chen Yu, Shu Ting, Zhang Jun, et al. Experimental study on effect of microwave pulse-width on detector feature. High Power Laser and Particle Beams, 2006, 18(5):876-880)

[10] 邱常玉,武丽芳,宋藏珍,等.截止波导在电磁屏蔽中的应用［J］.电子元器件及应用, 2012, 14(11):31-34.(Qiu Changyu, Wu Lifang, Song Cangzhen, et al. Cutoff waveguide in electromagnetic shielding application. Electronic Component & Device Applications, 2012, 14(11):31-34)