红外与激光工程, 2018, 47 (11): 1105002, 网络出版: 2019-01-10
高功率半导体激光器互连界面可靠性研究
Reliability of bonding interface in high power diode lasers
引用该论文
彭勃, 张普, 陈天奇, 赵崟岑, 吴的海, 刘晖. 高功率半导体激光器互连界面可靠性研究[J]. 红外与激光工程, 2018, 47(11): 1105002.
Peng Bo, Zhang Pu, Chen Tianqi, Zhao Yincen, Wu Dihai, Liu Hui. Reliability of bonding interface in high power diode lasers[J]. Infrared and Laser Engineering, 2018, 47(11): 1105002.
彭勃, 张普, 陈天奇, 赵崟岑, 吴的海, 刘晖. 高功率半导体激光器互连界面可靠性研究[J]. 红外与激光工程, 2018, 47(11): 1105002. Peng Bo, Zhang Pu, Chen Tianqi, Zhao Yincen, Wu Dihai, Liu Hui. Reliability of bonding interface in high power diode lasers[J]. Infrared and Laser Engineering, 2018, 47(11): 1105002.