激光电子散斑技术在集成电路封装热可靠性研究中的应用
熊显名, 胡放荣, 李根. 激光电子散斑技术在集成电路封装热可靠性研究中的应用[J]. 中国激光, 2006, 33(suppl): 395.
熊显名, 胡放荣, 李根. Application of Electronic Speckle Pattern Interferometry in Heat Reliability Research on Very Large Scale Integration Package[J]. Chinese Journal of Lasers, 2006, 33(suppl): 395.
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熊显名, 胡放荣, 李根. 激光电子散斑技术在集成电路封装热可靠性研究中的应用[J]. 中国激光, 2006, 33(suppl): 395. 熊显名, 胡放荣, 李根. Application of Electronic Speckle Pattern Interferometry in Heat Reliability Research on Very Large Scale Integration Package[J]. Chinese Journal of Lasers, 2006, 33(suppl): 395.
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