中国激光, 2006, 33 (suppl): 395, 网络出版: 2006-04-21
激光电子散斑技术在集成电路封装热可靠性研究中的应用
Application of Electronic Speckle Pattern Interferometry in Heat Reliability Research on Very Large Scale Integration Package
激光技术 超大规模集成电路 电子散斑干涉技术 封装 热可靠性 无损检测 laser techniques very large scale integration electronic speckle pattern interferometry package heat reliability nondestructive test and measurement
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熊显名, 胡放荣, 李根. 激光电子散斑技术在集成电路封装热可靠性研究中的应用[J]. 中国激光, 2006, 33(suppl): 395. 熊显名, 胡放荣, 李根. Application of Electronic Speckle Pattern Interferometry in Heat Reliability Research on Very Large Scale Integration Package[J]. Chinese Journal of Lasers, 2006, 33(suppl): 395.