基于烟囱效应的集成封装半导体照明光源散热结构优化设计

张国旺; 韩彦军; 罗毅; 李洪涛

半导体光电, 2013, 34 (5): 732, 网络出版: 2013-11-01

基于烟囱效应的集成封装半导体照明光源散热结构优化设计

Optimization of Heat Sink Design Based on Chimney Effect for Integrated Packaging Semiconductor Lighting Source

论文大纲

张国旺 ^1,*韩彦军 ¹罗毅 ^1,2李洪涛 ¹

作者单位

¹ 清华大学电子工程系清华信息科学技术国家实验室(筹)，北京 100084

² 清华大学深圳研究生院半导体照明实验室，广东深圳 518057

散热设计烟囱效应引流孔 COB LED COB LED heat dissipation design chimney effect conducting holes

摘要

针对基于集成封装发光二级管(COB LED)的半导体照明光源，研究了引流孔的形状、尺寸和位置等对基于烟囱效应的散热器的散热特性的影响。CFD仿真模拟表明，对于50W热功率的COB LED散热结构，在导热板上形成两个面积为15cm2、以光源中心对称的矩形引流孔，可在保持COB LED最高温度小于52℃的条件下，将基于烟囱效应的散热器的重量进一步降低15%。实验结果与模拟结果基本一致。

Abstract

For semiconductor lighting source based on integrated packaging light-emitting diode (COB LED), the effects of shape, size and distribution of air conducting holes on the heat dissipation characteristics of chimney effect based heat sink are studied. It is indicated by CFD simulations that, for the heat dissipation structure of COB LED of 50W thermal power, by forming two rectangular air conducting holes of 15cm2 symmetrically to the center of lighting source on the thermally conducting plate, the weight of the chimney effect based heat sink is further reduced by 15% while keeping the temperature of COB LED below 52℃. Experimental results and simulation results are basically consistent.

参考文献

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张国旺, 韩彦军, 罗毅, 李洪涛. 基于烟囱效应的集成封装半导体照明光源散热结构优化设计[J]. 半导体光电, 2013, 34(5): 732. ZHANG Guowang, HAN Yanjun, LUO Yi, LI Hongtao. Optimization of Heat Sink Design Based on Chimney Effect for Integrated Packaging Semiconductor Lighting Source[J]. Semiconductor Optoelectronics, 2013, 34(5): 732.

基于烟囱效应的集成封装半导体照明光源散热结构优化设计

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