模具半导体激光强韧化工艺研究
闵大勇, 王爱华, 熊志红, 卢飞星. 模具半导体激光强韧化工艺研究[J]. 激光技术, 2012, 36(3): 364.
MIN Da-yong, WANG Ai-hua, XIONG Zhi-hong, LU Fei-xing. Process research of diode laser surface hardening for dies[J]. Laser Technology, 2012, 36(3): 364.
[1] ZHOU J, WEN Z Y, LI B L. Laser surface treatment of the automobile mould material CrMo casting iron[J]. Mining and Metallurgical Engineering,2007,27(1):85-87(in Chinese).
[2] GUAN Y H, FAN G, CHEN T L, et al.Numerical analysis of thermal residual stresses during laser quenching[J]. Laser Technology,1998,22(5):313-317(in Chinese).
[5] ZHANG W Zh, YAN J.Study on three kinds of mould steel hardened bylaser surface heat treatment[J]. Laser Journal,2004,25(3):74-75(in Chinese).
[7] LI Y H, ZHOU D W, LIU J Sh.The application and development of the surface strengthening technology in die manufacturing field[J]. Chinese Materials Science Technology & Equipment,2006,3(5):42-47(in Chinese).
[8] CAI J, LIANG H F, LIU G L. The laser surface strengthening technology application of automobile large-scale cover mold[J]. Equipment Manufacturing Technology,2008(7):25-29(in Chinese).
[10] KENNEDY E, BYRNE G, COLLINS D N. A review of the use of high power diode lasers in surface hardening[J].Journal of Materials Processing Technology,2004,155/156:1855-1860.
[11] DOBRZA’NSKI L A, BONELK M, HAJDUCZWK E, et al. Application of high power diode laser (HPDL) for alloying of X40CrMoV5-1 steel surface layer by tungsten carbides[J]. Journal of Materials Processing Technology,2004,155/156:1956-1963.
[12] PANTSAR H, KUJANP V. Diode laser beam absorption in laser transformation hardening of low alloy steel[J]. Journal of Laser Applications,2004,16(3):147-153.
[13] PASHBY I R, BARNES S, BRYDEN B G.Surface hardening of steel using a high power diode laser[J]. Journal of Materials Processing Technology,2003,139(1/3):585-588.
闵大勇, 王爱华, 熊志红, 卢飞星. 模具半导体激光强韧化工艺研究[J]. 激光技术, 2012, 36(3): 364. MIN Da-yong, WANG Ai-hua, XIONG Zhi-hong, LU Fei-xing. Process research of diode laser surface hardening for dies[J]. Laser Technology, 2012, 36(3): 364.