激光技术, 2012, 36 (3): 364, 网络出版: 2012-05-22
模具半导体激光强韧化工艺研究
Process research of diode laser surface hardening for dies
补充材料
闵大勇, 王爱华, 熊志红, 卢飞星. 模具半导体激光强韧化工艺研究[J]. 激光技术, 2012, 36(3): 364. MIN Da-yong, WANG Ai-hua, XIONG Zhi-hong, LU Fei-xing. Process research of diode laser surface hardening for dies[J]. Laser Technology, 2012, 36(3): 364.