基于开缝基板的大功率LED散热性能研究

为了实现大功率多芯片LED的芯片直装散热(COH)封装的高效散热，提出了一种开缝基板的新型散热结构，并运用Icepak仿真软件模拟分析了在自然对流下不同缝间距对结温、热阻、流场分布和换热特性的影响。结果表明，开缝基板能有效改善流场分布，提高表面换热系数，增加散热性能。在传导和对流的双重作用下，存在最佳缝间距使结温和热阻最低，输入功率为1 W时，结温和热阻分别降低3.2 K和1.01 K/W。随芯片输入功率的增加，开缝基板的散热效果愈发明显。同时，开缝基板的提出也节省了器件封装成本。

Abstract

A novel heat-release structure with slotted plate is proposed to enhance the heat dissipation performance of high power multi-chip chip-on-heatsink (COH) LEDs. The junction temperature, thermal resistance, fluid field and the performance of heat dissipation are simulated and analyzed by Icepak software under natural convection. The simulation results show that the slotted plate can improve the flow feature of fluid field, increase the surface heat transfer coefficient, enhance the capability of heat dissipation. There is a best pitch between two plates to make the junction temperature and thermal resistance lower under the thermal conduction and thermal convection. And the junction temperature and thermal resistance lower 3.2 K and 1.01 K/W respectively when the input power of each chip is 1 W under the best pitch. For slotted plate, the capability of heat dissipation is enhanced obviously with the increasing of input power for each chip, and it also decreases the weight of plate and reduces the cost.

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田立新, 文尚胜, 姚日晖, 陈颖聪, 谢嘉宁. 基于开缝基板的大功率LED散热性能研究[J]. 光学学报, 2014, 34(11): 1123002. Tian Lixin, Wen Shangsheng, Yao Rihui, Chen Yingcong, Xie Jianing. Research on the Heat-Release Performance of High Power LED Using Slotted Plate[J]. Acta Optica Sinica, 2014, 34(11): 1123002.

基于开缝基板的大功率LED散热性能研究

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