消除半导体激光诱导腐蚀晶向影响的两步腐蚀新方法
[1] Kawagachi Yoshizo, Sato Tadatake, Narazaki Aiko et al.. Etching a microtrench with a maximum aspect ratio of 60 on silica glass by laserinduced backside wet etching[J]. Japanese J. Applied Physics, Part 2: Letters, 2005, 44(1~7): L176~L178
[2] L. W. Hrubesh, M. A. Norton, W. A. Molander et al.. Chemical etch effects on laserinduced surface damage growth in fused silica[C]. Proc. SPIE, 2001, 4347: 553~559
[3] Elin Steinsland, Terje Finstad, Anders Hanneberg et al.. Etch rates of (100), (111) and (110) singlecrystal silicon in TMAH measured in situ by laser reflectance interferometry[J]. Sensors and Actuators, A: Physical, 2000, 86(1~2): 73~80
[4] T. Oishi, M. Goto, Y. Pihosh et al.. Silicon microstructure fabricated by laser micropatterning method combined with wet etching process[J]. Appl. Sur. Sci., 2005, 241(1~2): 223~226
[5] . J, Choquette Kent. D et al.. Etching depth dependence of the effective refractive index in twodimensional photoniccrystalpatterned verticalcavity surfaceemitting laser structures[J]. Appl. Phys. Lett., 2003, 82(9): 1344-1346.
[6] . . Influence of Er∶YAG laser surface treatment and primer application methods on microtensile bond strength selfetching systems[J]. Photomedicine and Laser Surgery, 2005, 23(3): 304-312.
[7] . Mailis, G. W. Ross, L. Reekie et al.. Fabrication of surface relief gratings on lithium niobate by combined UV laser and wet etching[J]. Electron. Lett., 2000, 36(21): 1801-1803.
[8] Liu Lin, Zhao Suying, Liu Juanxiu et al.. Laser etching holes diameter controlling and transverse etching[J]. J. Optoelectronics Laser, 2005, 16(7): 841~844 (in Chinese)
刘霖,赵素英,刘娟秀 等. 激光化学腐蚀孔直径控制与横向腐蚀特性[J]. 光电子激光, 2005, 16(7): 841~844
刘霖, 叶玉堂, 吴云峰, 陈镇龙, 范超, 王昱琳. 消除半导体激光诱导腐蚀晶向影响的两步腐蚀新方法[J]. 光学学报, 2006, 26(10): 1565. 刘霖, 叶玉堂, 吴云峰, 陈镇龙, 范超, 王昱琳. New TwoStep Etching Method Wiping off Crystal Tropism Influence in Laser-Induced Wet Chemical Etching[J]. Acta Optica Sinica, 2006, 26(10): 1565.