Opto-Electronic Advances, 2019, 2 (1): 180017, Published Online: Mar. 26, 2019
Laser machining of transparent brittle materials: from machining strategies to applications 
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Basic Information
| DOI: | 10.29026/oea.2019.180017 |
| 中图分类号: | -- |
| 栏目: | Review |
| 项目基金: | This work is partially supported by the National Natural Science Foundation of China (51575114 and 51805093), the National Key R&D Program of China (2018YFB1107700) and Guangzhou Science and Technology Project (201607010156). |
| 收稿日期: | Sep. 20, 2018 |
| 修改稿日期: | -- |
| 网络出版日期: | Mar. 26, 2019 |
| 通讯作者: | |
| 备注: | -- |
Xiaozhu Xie, Caixia Zhou, Xin Wei, Wei Hu, Qinglei Ren. Laser machining of transparent brittle materials: from machining strategies to applications[J]. Opto-Electronic Advances, 2019, 2(1): 180017.
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