Chinese Optics Letters, 2018, 16 (1): 011404, Published Online: Jul. 17, 2018
Stress damage process of silicon wafer under millisecond laser irradiation 
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Basic Information
| DOI: | 10.3788/COL201816.011404 |
| 中图分类号: | -- |
| 栏目: | Lasers and Laser Optics |
| 项目基金: | This work was supported by the National Natural Science Foundation of China (No. 61605079) and the Fundamental Research Funds for the Central Universities (No. 30916014112-020). |
| 收稿日期: | Sep. 12, 2017 |
| 修改稿日期: | -- |
| 网络出版日期: | Jul. 17, 2018 |
| 通讯作者: | Xiaowu Ni (nxw@njust.edu.cn) |
| 备注: | -- |
Zhichao Jia, Tingzhong Zhang, Huazhong Zhu, Zewen Li, Zhonghua Shen, Jian Lu, Xiaowu Ni. Stress damage process of silicon wafer under millisecond laser irradiation[J]. Chinese Optics Letters, 2018, 16(1): 011404.
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