[1] Tuckerman D B, Pease R F W. Highperformance heat sinking for VLSI[J]. IEEE Electron Device Lett., 1981, 2(5): 126129.

[2] Chai L, Wang L, Bai X. Thermohydraulic performance of microchannel heat sinks with triangular ribs on sidewallsPart 2: Average fluid flow and heat transfer characteristics[J]. Inter. J. of Heat and Mass Transfer, 2019, 128: 634648.

[3] Shafeie H, Abouali O, Jafarpur K, et al. Numerical study of heat transfer performance of singlephase heat sinks with micro pinfin structures[J]. Appl. Thermal Engin., 2013, 58(1/2): 6876.

[4] Wong K C, Lee J H. Investigation of thermal performance of microchannel heat sink with triangular ribs in the transverse microchambers[J]. Inter. Commun. in Heat and Mass Transfer, 2015, 65: 103111.

[5] Chai L, Xia G, Liang Wang L, et al. Heat transfer enhancement in microchannel heat sinks with periodic expansionconstriction crosssections[J]. Inter. J. of Heat and Mass Transfer, 2013, 62: 741751.

[6] Wei X J, Joshi Y K, Ligrani P M. Numerical simulation of Laminar flow and heat transfer inside a microchannel with one dimpled surface[J]. J. Electronic Packaging, 2007, 129(1): 6370.

[7] Kosar A, Mishra C, Peles Y. Laminar flow across a bank of low aspect ratio micro pin fins[J]. J. Fluids Eng., 2005, 127(3): 419430.

[8] Brunschwiler T, Michel B, Rothuizen H, et al. Interlayer cooling potential in vertically integrated packages[J]. Microsystem Technol., 2009, 15(1): 5774.

[9] Mustafa Koz, Kosar A. Parameter optimization of a micro heat sink with circular pinfins[C]// Proc. ASME 8th Inter. Conf. on Nanochannels, Microchannels and Minichannels, 2010: 531539.

[10] Tullius J F, Tullius T K, Bayazitoglu Y. Optimization of short micro pin fins in minichannels[J]. Inter. J. of Heat and Mass Transfer, 2012, 55(15/16): 39213932.

[11] Lorenzini D, Green C, Sarvey T E, et al. Embedded single phase microfluidic thermal management for nonuniform heating and hotspots using microgaps with variable pin fin clustering[J]. Inter. J. of Heat and Mass Transfer, 2016, 103: 13591370.

[12] Lorenzini D, Joshi Y. Numerical modeling and experimental validation of twophase microfluidic cooling in silicon devices for vertical integration of microelectronics[J]. Inter. J. of Heat and Mass Transfer, 2019, 138: 194207.

[13] 史晓军, 李 珊, 魏亚东, 等. 纳米流体矩形微通道热沉结构参数多目标优化[J]. 西安交通大学学报, 2018, 52(5): 5661.

    Shi Xiaojun, Li Shan, Wei Yadong, et al. Multiobjective optimization on the geometrical parameters of a nanofluidcooled rectangular microchannel heat sink[J]. J. of Xian Jiaotong University, 2018, 52(5): 5661.

[14] Shi X, Li S, Mu Y, et al. Geometry parameters optimization for a microchannel heat sink with secondary flow channel[J]. Inter. Commun. in Heat and Mass Transfer, 2019, 104: 89100.

[15] Hadad Y, Ramakrishnan B, Pejman R, et al. Threeobjective shape optimization and parametric study of a microchannel heat sink with discrete nonuniform heat flux boundary conditions[J]. Appl. Thermal Engin., 2019, 150: 720737.

[16] Rao R V, More K C, Taler J, et al. Dimensional optimization of a microchannel heat sink using Jaya algorithm[J]. Appl. Thermal Engin., 2016, 103: 572582.