三维发光LED 灯片散热设计和测试研究

三维发光LED 灯片因其360°发光的优点成为制备球泡灯的首选光源。但是与其他LED 光源相比，三维发光LED 灯片的散热通道由纵向变为横向，散热要求更高。通过热模拟软件探求最佳散热三维灯片设计模型，通过对比优化其基板结构和芯片排布方式将同样驱动功率下基板的温度由130 ℃降至83 ℃。为验证模拟的准确性开模制备这两种灯片，并对两种灯片不同位置和热沉同时测温监控发现，300 s 内发光灯片和热沉上的温度达到平衡，两种灯片样品上的温度与模拟的温度基本相同。结果表明，优化后的三维发光LED 灯片具有良好的散热性能，可满足三维发光LED 灯片产业化产品需求。

Abstract

Three-dimensional light-emitting diodes (LEDs) have been the preferred light source for bulb lamp due to their 360° illumination. However, compared with other light sources, this encapsulation requires better cooling function owing to its heat dissipation channel changing from longitudinal to transverse. Therefore, this work attempts to design the best thermal dissipation model of the three-dimensional LEDs through thermal simulation software. By comparing optimization of the substrate and chip pattern mode, the temperature of substrate decreases from 130 ℃ to 83 ℃ under the same drive current condition. In order to verify the accuracy of simulation, two samples are made to test the performances of thermal dissipation. The temperature of samples can achieve equilibrium in 300 s. Moreover, the test results are in accord with the simulation results. Experimental results show that the optimization of three- dimensional light- emitting LED lights with good heat dissipation performance can satisfy the industrialization product demand of the three-dimensional light-emitting LED lights.

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