基于光学读出非制冷红外成像系统的无基底FPA等效电学模型

张勇; 程腾; 张青川; 陈大鹏; 高杰; 毛亮; 吴健雄; 高越

doi:doi:10.3724/sp.j.1010.2013.00394

红外与毫米波学报, 2013, 32 (5): 394, 网络出版: 2013-10-23

基于光学读出非制冷红外成像系统的无基底FPA等效电学模型

Equivalent circuit model of the substrate-free focal plane array based on the optical readout uncooled infrared imaging system

论文大纲

张勇 ^1,*程腾 ¹张青川 ¹陈大鹏 ²高杰 ¹毛亮 ¹吴健雄 ¹高越 ¹

作者单位

¹ 中国科学技术大学中国科学院材料力学行为和设计重点实验室, 安徽合肥 230027

² 中国科学院微电子研究所, 北京 100029

摘要

与传统的有基底FPA(焦平面阵列)相比, 基于全镂空支撑框架结构的新型无基底FPA在热学特性上存在显著差异, 传统的基于恒温基底假设的热学分析模型不再适用, 因此, 通过电学比拟方法, 将无基底FPA的热响应特性等效为电学模型.通过该模型, 进一步分析了无基底FPA在非真空环境下的热学性能, 分析表明: 该无基底FPA具有在大气压下优良的红外成像性能, 其NETD(噪声等效温度差)值仅比真空环境下增加了数倍.

Abstract

Thermal characteristics of new substrate-free FPA (focal plane array) with full hollow supporting frame structure are very different from that of traditional substrate FPA. The thermal analysis model which based on temperature-constant substrate assumption is not efficient any more. Therefore, an equivalent circuit model was presented to analyze the thermal response characteristics of substrate-free FPA with electrics and holistic approach. According to this model, the thermal characteristics of substrate-free FPA under non-vacuum environment were analyzed. The result shows that, the substrate-free FPA has excellent infrared imaging performances under atmospheric pressure, while its NETD (noise equivalent temperature difference) is just increased several times than in the vacuum environment.

参考文献

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张勇, 程腾, 张青川, 陈大鹏, 高杰, 毛亮, 吴健雄, 高越. 基于光学读出非制冷红外成像系统的无基底FPA等效电学模型[J]. 红外与毫米波学报, 2013, 32(5): 394. ZHANG Yong, CHENG Teng, ZHANG Qing-Chuan, CHEN Da-Peng, GAO Jie, MAO Liang, WU Jian-Xiong, GAO Yue. Equivalent circuit model of the substrate-free focal plane array based on the optical readout uncooled infrared imaging system[J]. Journal of Infrared and Millimeter Waves, 2013, 32(5): 394.

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