以光子为信息传输媒介的光子集成芯片，具有高带宽、高速率、高灵敏度等优点，在光通信、光互联、光学传感等领域得到了广泛的研究与应用。为了进一步提高光子集成芯片的集成度、扩展光子集成芯片的功能，在原本二维平面的光子集成芯片的基础上，通过晶圆键合、气相沉积、磁控溅射等方法，制备三维集成光子芯片。利用多层堆叠的方式，使光子集成芯片在厚度上进行拓展，在紧凑的尺寸上，实现大规模集成光子芯片的制备。本文介绍了几种三维光子集成芯片的材料平台与制备工艺，包括单晶硅（c-Si）键合、SiN-on-SOI、非晶硅（a-Si）沉积、多晶硅（p-Si）沉积和聚合物三维光子集成芯片制造平台，结合关键器件与在光互连、光通信、激光雷达等领域的应用，介绍了不同工艺平台的发展现状与挑战。

Conventional electronic processors, which are the mainstream and almost invincible hardware for computation, are approaching their limits in both computational power and energy efficiency, especially in large-scale matrix computation. By combining electronic, photonic, and optoelectronic devices and circuits together, silicon-based optoelectronic matrix computation has been demonstrating great capabilities and feasibilities. Matrix computation is one of the few general-purpose computations that have the potential to exceed the computation performance of digital logic circuits in energy efficiency, computational power, and latency. Moreover, electronic processors also suffer from the tremendous energy consumption of the digital transceiver circuits during high-capacity data interconnections. We review the recent progress in photonic matrix computation, including matrix-vector multiplication, convolution, and multiply–accumulate operations in artificial neural networks, quantum information processing, combinatorial optimization, and compressed sensing, with particular attention paid to energy consumption. We also summarize the advantages of silicon-based optoelectronic matrix computation in data interconnections and photonic-electronic integration over conventional optical computing processors. Looking toward the future of silicon-based optoelectronic matrix computations, we believe that silicon-based optoelectronics is a promising and comprehensive platform for disruptively improving general-purpose matrix computation performance in the post-Moore’s law era.