[1] PUSEL A, HESS P. Time-of-flight analysis and modeling of photochemical hydrogen desorption from silicon (111) with an F2 laser[J]. Surface Science,1999,433/435:74-78.

[2] HERMAN P R, MARJORIBANKS R S, OETTL A, et al. Laser shaping of photonic materials: deep-ultraviolet and ultrafast lasers [J]. Applied Surface Science, 2000, 154/155(1/4):577-586.

[3] GREUTERS J, RIZVI N H. Laser micromachining of optical materials with a 157nm fluorine laser[J]. Procecdings of SPIE, 2002, 4941:77-83.

[4] LIAO Y S, CHEN Y T, CHAO C L, et al. Surface morphology and sub-surface damaged layer of various glasses machined by 193nm ArF excimer laser[J]. Proceedings of SPIE, 2005, 5715:110-117.

[5] YE Zh H, LOU Q H, LI H X, et al. Beam homogenizing technology for UV excimer laser[J]. Laser Technology, 2005, 29 (2):207-209(in Chinese).

[6] WANG J Zh, SHI T L, XIONG L C. A shortened procedure of micro-electromechanical systems fabrication by means of femtosecond laser[J]. Laser Technology,2008,32(1):88-91(in Chinese).

[7] ENDERT H, KAUF M, MAYER E, et al. Microstructuring with 157nm laser light [J]. Proceedings of SPIE,1999,3618:413-417.

[8] LI W L, LI Y, LI W. Mechanism study of silica ablating on photonic crystal fiber by 157nm laser[J]. Laser Technology,2006,30(6):601-604(in Chinese).

[9] DAI Y T, XU G, LI W L. Laser micromachining of wide bandgap materials[J]. Advanced Materials Research,2009,69/70:118-122.

[10] DAI Y T, XU G, CUI J L, et al. Micro etching of GaN-based semiconductor materials using 157nm laser[J]. Chinese Journal of Lasers, 2009,36(12):3138-3142(in Chinese).