红外与激光工程, 2019, 48 (1): 0105002, 网络出版: 2019-04-02   

915 nm半导体激光器新型腔面钝化工艺

915 nm semiconductor laser new type facet passivation technology
作者单位
1 中国科学院半导体研究所, 北京 100083
2 中国科学院大学, 北京 100049
引用该论文

王鑫, 朱凌妮, 赵懿昊, 孔金霞, 王翠鸾, 熊聪, 马骁宇, 刘素平. 915 nm半导体激光器新型腔面钝化工艺[J]. 红外与激光工程, 2019, 48(1): 0105002.

Wang Xin, Zhu Lingni, Zhao Yihao, Kong Jinxia, Wang Cuiluan, Xiong Cong, Ma Xiaoyu, Liu Suping. 915 nm semiconductor laser new type facet passivation technology[J]. Infrared and Laser Engineering, 2019, 48(1): 0105002.

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王鑫, 朱凌妮, 赵懿昊, 孔金霞, 王翠鸾, 熊聪, 马骁宇, 刘素平. 915 nm半导体激光器新型腔面钝化工艺[J]. 红外与激光工程, 2019, 48(1): 0105002. Wang Xin, Zhu Lingni, Zhao Yihao, Kong Jinxia, Wang Cuiluan, Xiong Cong, Ma Xiaoyu, Liu Suping. 915 nm semiconductor laser new type facet passivation technology[J]. Infrared and Laser Engineering, 2019, 48(1): 0105002.

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