中国激光, 2018, 45 (1): 0101002, 网络出版: 2018-01-24
碳化硅封装高功率半导体激光器散热性能研究 下载: 1359次
Thermal Performance of High-Power Laser Diodes Packaged by SiC Ceramic Submount
引用该论文
倪羽茜, 井红旗, 孔金霞, 王翠鸾, 刘素平, 马骁宇. 碳化硅封装高功率半导体激光器散热性能研究[J]. 中国激光, 2018, 45(1): 0101002.
Ni Yuxi, Jing Hongqi, Kong Jinxia, Wang Cuiluan, Liu Suping, Ma Xiaoyu. Thermal Performance of High-Power Laser Diodes Packaged by SiC Ceramic Submount[J]. Chinese Journal of Lasers, 2018, 45(1): 0101002.
倪羽茜, 井红旗, 孔金霞, 王翠鸾, 刘素平, 马骁宇. 碳化硅封装高功率半导体激光器散热性能研究[J]. 中国激光, 2018, 45(1): 0101002. Ni Yuxi, Jing Hongqi, Kong Jinxia, Wang Cuiluan, Liu Suping, Ma Xiaoyu. Thermal Performance of High-Power Laser Diodes Packaged by SiC Ceramic Submount[J]. Chinese Journal of Lasers, 2018, 45(1): 0101002.