[1] 辛国锋, 瞿荣辉, 方祖捷, 等. 大功率半导体激光器的最新进展[J]. 激光与光电子学进展, 2006, 43(2): 3-8.

    Xin G F, Qu R H, Fang Z J, et al. New development of high power semiconductor laser[J]. Laser & Optoelectronics Progress, 2006, 43(2): 3-8.

[2] 马骁宇, 王俊, 刘素平. 国内大功率半导体激光器研究及应用现状[J]. 红外与激光工程, 2008( 2): 189- 194.

    Ma XY, WangJ, Liu SP. Present situation of investigations and applications in high power semiconductor lasers[J]. Infrared and Laser Engineering, 2008( 2): 189- 194.

[3] 井红旗, 仲莉, 倪羽茜, 等. 高功率密度激光二极管叠层散热结构的热分析[J]. 发光学报, 2016, 37(1): 81-87.

    Jing H Q, Zhong L, Ni Y X, et al. Thermal analysis of high power density laser diode stack cooling structure[J]. Chinese Journal of Luminescence, 2016, 37(1): 81-87.

[4] 金菊其. 大功率半导体激光器的阵列化技术[J]. 激光与光电子学进展, 2001, 38(8): 31-35.

    Jin G Q. Array technology of high power semiconductor laser[J]. Laser & Optoelectronics Progress, 2001, 38(8): 31-35.

[5] Xiong H P, Li X H, Mao W, et al. Wetting behavior of Co based active brazing alloys on SiC and the interfacial reactions[J]. Materials Letters, 2003, 57(22/23): 3417-3421.

[6] 席道明. 大功率半导体激光器高频封装技术研究[D]. 长春: 长春理工大学, 2013.

    Xi DM. Research on high-frequency packaging technology of high power semiconductor laser[D]. Changchun: Changchun University of Science and Technology, 2013.

[7] 辛国锋, 瞿荣辉, 陈高庭, 等. 大功率半导体激光器阵列的封装技术[J]. 激光与光电子学进展, 2005, 42(8): 54-57.

    Xin G F, Qu R H, Chen G T, et al. Packaging techniques of high power semiconductor laser arrays[J]. Laser & Optoelectronics Progress, 2005, 42(8): 54-57.

[8] 耿磊, 马潇, 肖志涛, 等. X射线线阵探测器校正与滤波[J]. 红外与激光工程, 2017, 46(12): 1226001.

    Geng L, Ma X, Xiao Z T, et al. Calibration and filtering of X-ray line array detector[J]. Infrared and Laser Engineering, 2017, 46(12): 1226001.

[9] Yoon J W, Chun H S, Koo J M, et al. Au-Sn flip-chip solder bump for microelectronic and optoelectronic applications[J]. Microsystem Technologies, 2007, 13(11/12): 1463-1469.

[10] Yu D Q, Oppermann H, Kleff J, et al. Stability of AuSn eutectic solder cap on Au socket during reflow[J]. Journal of Materials Science: Materials in Electronics, 2009, 20(1): 55-59.

[11] 王祥鹏, 李再金, 刘云, 等. 半导体激光器列阵的smile效应与封装技术[J]. 光学精密工程, 2010, 18(3): 552-557.

    Wang X P, Li Z J, Liu Y, et al. Smile effect and package technique for diode laser arrays[J]. Optics and Precision Engineering, 2010, 18(3): 552-557.

[12] 郭林辉. 大功率二极管激光线阵封装中的应力检测方法研究[D]. 长春: 长春理工大学, 2009.

    Guo LH. Study on measurement of packaging-induced stress in high-power diode laser arrays[D]. Changchun: Changchun University of Science and Technology, 2009.

[13] 贾冠男, 尧舜, 潘飞, 等. 探针扫描法快速测量半导体激光阵列Smile效应[J]. 红外与激光工程, 2015, 44(12): 3576-3579.

    Jia G N, Yao S, Pan F, et al. Smile effect of laser diode arrays measured by stylus scan method[J]. Infrared and Laser Engineering, 2015, 44(12): 3576-3579.

[14] 陈华, 李静, 周兴林, 等. 封装热应力致半导体激光器“Smile”效应的抑制方法[J]. 发光学报, 2017, 38(5): 656-662.

    Chen H, Li J, Zhou X L, et al. Measures to reduce smile effect of semiconductor laser diode arrays caused by packaging thermal stress[J]. Chinese Journal of Luminescence, 2017, 38(5): 656-662.

[15] 张勇, 杨瑞霞, 安振峰, 等. 4 mm腔长高功率单管半导体激光器封装应力的研究[J]. 光谱学与光谱分析, 2014, 34(6): 1441-1445.

    Zhang Y, Yang R X, An Z F, et al. Study on packaging-induced stress in 4 mm cavity length high-power single emitter semiconductor laser[J]. Spectroscopy and Spectral Analysis, 2014, 34(6): 1441-1445.