半导体光电, 2015, 36 (4): 602, 网络出版: 2015-09-08
三种光电外壳光窗封接工艺的强度对比分析
Contrast Analysis of Intensity of Optoelectronic Packages for Three Optical Window Capsulation Techniques
图 & 表
曹红艳, 袁礼华, 杨拓, 江德凤. 三种光电外壳光窗封接工艺的强度对比分析[J]. 半导体光电, 2015, 36(4): 602. CAO Hongyan, YUAN Lihua, YANG Tuo, JIANG Defeng. Contrast Analysis of Intensity of Optoelectronic Packages for Three Optical Window Capsulation Techniques[J]. Semiconductor Optoelectronics, 2015, 36(4): 602.