[1] 袁礼华, 袁中朝, 谭千里.高强度带光窗光电外壳设计[J].半导体光电, 2011, 32(2): 192-199.

    Yuan Lihua,Yuan Zhongchao, Tan Qianli. Design of high intensity photoelectric package with optical window[J]. Semiconductor Optoelectronics, 2011, 32(2): 192-194.

[2] 邱言龙, 雷振国, 聂正斌.钎焊技术快速入门[M].上海: 上海科学技术出版社, 2011.

    Qiu Yanlong,Lei Zhenguo, Nie Zhengbin. Introduction of Brazing Technology[M]. Shanghai: Shanghai Science Technology Press,2011.

[3] 冷文波, 沈卓身.可伐合金气密性封接的预氧化[J].电子与封装, 2004, 4(3): 33-41.

    Leng Wenbo,Shen Zuoshen. Preoxidation of Kovar Alloy for Hermetic Sealing[J]. Electronics & Packaging, 2004, 4(3): 33-41.

[4] 罗大为.可伐合金的可控氧化对封接质量的影响[J].电子元件与材料,2011, 30(5): 61-64.

    Luo Dawei. Effect of control oxidation of Kovar alloy on its sealing quality with glass[J]. Electronic Components & Materials, 2011, 30(5): 61-64.

[5] 周涛, 汤姆·鲍勃, 马丁·奥德, 等. 金锡焊料及其在电子器件封装领域中的应用[J].电子与封装, 2005, 5(8): 5-8.

    Zhou Tao,Tom Bobal, Martin Oud, et al. An Introduction to Eutectic Au/Sn Solder Alloy and Its Preforms in Microelectronics/Optoelectronic Packaging Applications[J]. Electronics and Packaging, 2005, 5(8): 5-8.

[6] 田英良, 孙诗兵.新编玻璃工艺学[M].北京: 中国轻工业出版社, 2009.

    Tian Yingliang,Sun Shibing. New Glass Process[M].Beijing: China Light Industry Press,2009.

[7] 何荣华, 张亚, 李波.军用电子元件的可靠性强化试验方案研究[J].科学技术与工程, 2009, 9(18): 5460-5464.

    He Ronghua,Zhang Ya, LI Bo, et al. Research program of reliability enhancement test about military electronic components[J]. Science Technology and Engineering, 2009, 9(18): 5460-5464.

[8] 尹芳, 张亚, 何荣华. 引信高过载步进应力试验的冲击次数折算[J].弹箭与制导学报, 2011, 31(5): 96-98.

    Yin Fang,Zhang Ya, He Ronghua. Impact times conversion of high overload step-stress testing for fuze[J]. J. Projectiles, Rockets, Missiles and Guidance, 2011, 31(5): 96-98.