强激光与粒子束, 2013, 25 (11): 2826, 网络出版: 2013-11-14   

磁控溅射硅基薄膜应力演化实时研究

In situ stress evolution in magnetron-sputtered Si-based thin films
作者单位
1 中国科学院 上海光学精密机械研究所, 强激光材料重点实验室, 上海 201800
2 中国科学院大学, 北京 100049
3 中国工程物理研究院 上海激光等离子体所, 上海 201800
摘要
采用多光束应力实时测量装置监控并分析了磁控溅射Si和SiNx薄膜的总力及应力演化过程。在两种膜层中均观察到了应力释放及恢复现象。Si膜中应力是可逆的,而SiNx膜中应力是部分可逆的。物理吸附和解吸附分别是应力释放和恢复的主要原因。不可逆的应力分量来源于化学吸附,基于吸附机制建立了一个应力释放模型。
Abstract
An in situ multi-beam optical stress sensor system was used to monitor and analyze the force per unit width and stress evolution during and after the deposition of magnetron-sputtered Si and SiNx films. A rapid stress relaxation, as well as a recovery, was observed in both films. Stress in Si films was reversible, while partially reversible in SiNx films. Physical adsorption and desorption are the main factors responsible for the stress relaxation and recovery. The non-reversible stress component results from chemical adsorption. And a model based on adsorption is proposed to explain the stress relaxation.
参考文献

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李静平, 方明, 贺洪波, 邵建达, 李朝阳. 磁控溅射硅基薄膜应力演化实时研究[J]. 强激光与粒子束, 2013, 25(11): 2826. Li Jingping, Fang Ming, He Hongbo, Shao Jianda, Li Zhaoyang. In situ stress evolution in magnetron-sputtered Si-based thin films[J]. High Power Laser and Particle Beams, 2013, 25(11): 2826.

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