发光学报, 2015, 36 (6): 692, 网络出版: 2015-06-25
高效率GaN基高压LED芯片的制备及COB封装
High Efficiency GaN-based High-voltage Light-emitting Diode Chips and Its Chip-on-board Packaging
Metrics
摘要访问:4147次
PDF 下载:12次
全文浏览:4次
总被查询:0次
黄晓升, 黄华茂, 王洪, 李静. 高效率GaN基高压LED芯片的制备及COB封装[J]. 发光学报, 2015, 36(6): 692. HUANG Xiao-sheng, HUANG Hua-mao, WANG Hong, LI Jing. High Efficiency GaN-based High-voltage Light-emitting Diode Chips and Its Chip-on-board Packaging[J]. Chinese Journal of Luminescence, 2015, 36(6): 692.
PDF全文
