大功率半导体激光器阵列的稳态和瞬态热行为
[1] Xingsheng Liu, Martin H. Hu, Catherine G. Caneau et al.. Thermal management stategies for high power semiconductor pump lasers[C]. Inter Society Conference on Thermal Phenomena, IEEE, 2004. 493～500
[2] . 大功率半导体激光器阵列热特性分析[J]. 半导体技术, 2006, 31(11): 843-846.
. . Thermal analysis of high power semiconductor laser arreys[J]. Semiconductor Technology, 2006, 31(11): 843-846.
[3] . 半导体激光器散热技术研究及进展[J]. 电子与封装, 2007, 7(3): 27-32.
. . The study and prospects of heat sink technology about semiconductor lasers[J]. Electronics & Packaging, 2007, 7(3): 27-32.
[4] Jingwei Wang, Xingsheng Liu, Peiyong Wei. Study of the mechanisms of spectral broadening in high power semiconductor laser arreys[C]. Electronic Components and Technology Conference, IEEE, 2008. 1005～1010
[5] . Davis, Lawrence C. Hughes et al.. A study on the reliability of indium solder die bonding of high power semiconductor lasers[J]. J. Appl. Phys., 2006, 100: 013104.
[6] Schleuning David, Griffin Mike, James Phillip et al.. Robust hard-solder packaging of conduction cooled laser diode bars[C]. SPIE, 2007, 645604: 1～11
[7] 杨世铭, 陶文铨. 传热学[M]. 北京： 高等教育出版社, 1998. 63～100
Yang Shiming, Tao Wenquan. Heat Transfer[M]. Beijing: Higher Education Press, 1998. 63～100
袁振邦, 王警卫, 吴迪, 陈旭, 刘兴胜. 大功率半导体激光器阵列的稳态和瞬态热行为[J]. 中国激光, 2009, 36(8): 1957. Yuan Zhenbang, Wang Jingwei, Wu Di, Chen Xu, Liu Xingsheng. Static and Transient Thermal Behavior of High Power Semiconductor Lasers[J]. Chinese Journal of Lasers, 2009, 36(8): 1957.
PDF全文
