为了获得成形良好、气孔少的玻璃焊接焊缝, 采用在中间层添加对激光波长不透明玻璃料的方法, 对玻璃与玻璃激光焊接中出现的气孔问题进行了研究。以半导体激光作为热源, 搭建了用于玻璃与玻璃激光焊接的成套焊接设备, 对玻璃与玻璃激光焊接工艺进行了实验研究。通过分析气孔分布特征, 统计焊缝气孔率, 测量气孔尺寸, 对比焊缝正、反面形貌差异, 研究了激光平均功率、焊接速率等工艺参量对焊缝气孔产生的规律及表面形貌的影响。结果表明, 当激光功率过小、焊接速率过慢时, 不利于抑制焊缝中气孔的产生, 并且出现未焊上的情况; 随着激光功率、焊接速率的增加, 焊缝当中的气孔率显著上升; 在激光功率P=35Ｗ、焊接速率v＝0.1m/min、离焦量d=-15mm时, 可获得成形良好、气孔直径在3.696μm以下且分布均匀的焊缝, 连接强度高。此研究可为玻璃的激光封接制造提供理论依据, 具有广泛的工业应用前景。

In order to obtain the glass welding seam with good shape and few pores, the method of adding opaque glass frit to the middle layer was used to study the porosity problem in the laser welding of glass. A complete set of welding equipment for laser welding of glass and glass was built with semiconductor laser as the heat source. By analyzing the characteristics of porosity distribution, counting the porosity of weld, measuring the size of porosity, comparing the difference between the front and backside of the weld, the influence of laser average power, welding speed and other process parameters on the formation of porosity and the surface morphology of weld was studied. The results show that when the laser power is too small and the welding speed is too slow, it is not conducive to inhibit the generation of pores in the weld, and the glass plate may not be welded. With the increase of laser power and welding speed, the porosity in the weld increases significantly. When the laser power P, the welding rate v, and the defocusing amount d is respectively set to beequals 35W, 0.1m/min, and -15mm, a well-formed weld with a pore diameter of less than 3.696μm and a uniform distribution can be obtained, and the connection strength is high. This research can provide a theoretical basis for laser sealing of glass, and has a wide industrial application prospect.