半导体单光子雪崩二极管可实现微弱信号的探测, 在量子通讯、激光雷达和大气探测等领域具有重要应用。虽然半导体单光子雪崩二极管的性能主要取决于探测芯片设计、流片工艺和外围匹配电路的设计, 但后续的封装技术对其探测性能也有重要的影响。聚焦多年来半导体单光子雪崩二极管的封装发展, 简要介绍了相应封装形式和技术, 以及封装对于雪崩二极管性能的影响, 最后对半导体单光子雪崩二极管的封装发展前景做出了展望。

Semiconductor single-photon avalanche photodiodes can carry out weak signals detections and have important applications in quantum communications, lidar and atmospheric detection. Although the performance of semiconductor single-photon avalanche photodiodes mainly depends on the design of detector chip, chip fabrication technology and design of peripheral matching circuit, the subsequent packaging technology also has an important influence on its performance. This paper focuses on the packaging development of semiconductor single-photon avalanche photodiodes over the years. The corresponding packaging forms and technologies briefly are introduced, as well as the impact of packaging on the performance of avalanche photodiodes. Finally a prospect for the packaging development of semiconductor single-photon avalanche photodiodes is presented.