针对应用最为广泛、可靠的光纤光栅(FBG)埋入式封装,进行了光纤光栅标准化封装设计的理论和实验研究。通过对光纤应变传递分析模型的边界条件和变形协调条件,以及现有主要应变传递特征方程的分析,构造静定应变传递特征方程,得到光纤光栅封装结构统一的应变传递关系,从而建立光纤光栅标准化埋入式封装设计统一的基本理论模型。对封装元件的实验测试结果表明,基于经典剪滞理论及Ansari应变传递分析模型得到的理论模型,对由较低模量的粘接材料构成的封装元件的设计和分析较为可靠。

Aiming at the most common and reliable way of packaging-embedded packaging,theoretical and experimental studies on standard packaging design are conducted. Through the analysis of boundary conditions and deformation compatibility conditions of established optical fiber strain transferring analytical model as well as existing main strain transferring characteristic equations,a determined strain transferring characteristic equation is developed,and thus an universal strain transferring relationship is established,which may serve as a basic theoretical model for standard embedded fiber Bragg grating (FBG) packaged structure design. The tested results of packaged models show that strain transferring relationship sestablished according to classic shear lag theory and Ansari′s fiber optical strain transferring analytical model are more reliable for packaged structures containing relative low modulus adhesive materials.