中国激光, 2017, 44 (1): 0102016, 网络出版: 2017-01-10
全光纤皮秒激光切割蓝宝石晶圆的实验研究 下载: 1706次
Dicing of Sapphire Wafer with All-Fiber Picosecond Laser
图 & 表
图 2. 激光器稳定性能测试。(a)重复频率稳定性,左侧插图为20 MHz激光种子源脉冲序列,右侧插图为重复频率100 kHz时的8脉冲输出;(b)功率稳定性
Fig. 2. Stability of the laser system. (a) Repetition frequency stability, the left inset is the mode locked pulse train at 20 MHz repetition rate, and the right inset shows 8 pulses in a single pulse train at 100 kHz repetition rate; (b) power stability
图 4. 不同平均功率下的切片外观图。(a) 0.27 W;(b) 0.32 W;(c) 0.4 W;(d) 0.5 W
Fig. 4. Extrinsic feature of chips diced at different average power. (a) 0.27 W; (b) 0.32 W; (c) 0.4 W; (d) 0.5 W
图 5. 不同光斑圆度下的切片外观图。(a)圆度小于80%;(b)圆度约为85%;(c)圆度大于95%
Fig. 5. Extrinsic feature of chips diced by laser with different spot roundness. (a) Less than 80%; (b) about 85%; (c) more than 95%
表 1不同脉冲数切片的LED芯片良品率
Table1. Yield rate of LED chips diced with different number of pulses
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胡小豹, 郝强, 郭政儒, 曾和平. 全光纤皮秒激光切割蓝宝石晶圆的实验研究[J]. 中国激光, 2017, 44(1): 0102016. Hu Xiaobao, Hao Qiang, Guo Zhengru, Zeng Heping. Dicing of Sapphire Wafer with All-Fiber Picosecond Laser[J]. Chinese Journal of Lasers, 2017, 44(1): 0102016.