光子学报, 2017, 46 (10): 1014004, 网络出版: 2017-11-24
飞秒激光打孔硅的孔洞形貌研究
Hole Morphology in Femtosecond Laser Drilling of Silicon
图 & 表
李志明, 王玺, 聂劲松. 飞秒激光打孔硅的孔洞形貌研究[J]. 光子学报, 2017, 46(10): 1014004. LI Zhi-ming, WANG Xi, NIE Jin-song. Hole Morphology in Femtosecond Laser Drilling of Silicon[J]. ACTA PHOTONICA SINICA, 2017, 46(10): 1014004.