半导体光电, 2014, 35 (5): 820, 网络出版: 2014-10-23
钝化剂自组装单层膜在铜铜键合工艺中的应用
Application of Self-assembled Monolayer Passivation for Cu-Cu Bonding
补充材料
独莉, 廖广兰, 张昆, 宿磊, 薛栋民. 钝化剂自组装单层膜在铜铜键合工艺中的应用[J]. 半导体光电, 2014, 35(5): 820. DU Li, LIAO Guanglan, ZHANG Kun, SU Lei, XUE Dongmin. Application of Self-assembled Monolayer Passivation for Cu-Cu Bonding[J]. Semiconductor Optoelectronics, 2014, 35(5): 820.