中国光学, 2017, 10 (6): 744, 网络出版: 2017-12-25   

双波段芯片集成封装组件的低温光谱定量化

Low temperature spectroscopy quantification of integrated dual band chip package
作者单位
1 中国科学院 上海技术物理研究所 传感技术联合国家重点实验室, 上海 200083
2 中国科学院 上海技术物理研究所 中国科学院红外成像材料与器件重点实验室, 上海 200083
3 中国科学院大学, 北京 100049
引用该论文

徐勤飞, 刘大福, 龚海梅, 吴家荣, 蒋梦蝶, 张亚妮, 季鹏, 王仍, 张麟. 双波段芯片集成封装组件的低温光谱定量化[J]. 中国光学, 2017, 10(6): 744.

XU Qin-fei, LIU Da-fu, GONG Hai-mei, WU Jia-rong, JIANG Meng-die, ZHANG Ya-ni, JI Peng, WANG Reng, ZHANG Lin. Low temperature spectroscopy quantification of integrated dual band chip package[J]. Chinese Optics, 2017, 10(6): 744.

参考文献

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徐勤飞, 刘大福, 龚海梅, 吴家荣, 蒋梦蝶, 张亚妮, 季鹏, 王仍, 张麟. 双波段芯片集成封装组件的低温光谱定量化[J]. 中国光学, 2017, 10(6): 744. XU Qin-fei, LIU Da-fu, GONG Hai-mei, WU Jia-rong, JIANG Meng-die, ZHANG Ya-ni, JI Peng, WANG Reng, ZHANG Lin. Low temperature spectroscopy quantification of integrated dual band chip package[J]. Chinese Optics, 2017, 10(6): 744.

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