黏附层以及退火气氛对Au/Si共晶体系中硅扩散的影响研究
佟路, 戴姜平, 谢自力, 修向前, 赵红, 陈鹏, 张荣, 施毅, 韩平, 郑有炓. 黏附层以及退火气氛对Au/Si共晶体系中硅扩散的影响研究[J]. 半导体光电, 2015, 36(5): 722.
TONG Lu, DAI Jiangping, XIE Ziii, XIU Xiangqian, ZHAO Hong, CHEN Peng, ZHANG Rong, SHI Yi, HAN Ping, ZHENG Youdou. Effect of Adhesion Layer and Annealing Ambient on the Diffusion in Si/Au Eutectic System[J]. Semiconductor Optoelectronics, 2015, 36(5): 722.
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佟路, 戴姜平, 谢自力, 修向前, 赵红, 陈鹏, 张荣, 施毅, 韩平, 郑有炓. 黏附层以及退火气氛对Au/Si共晶体系中硅扩散的影响研究[J]. 半导体光电, 2015, 36(5): 722. TONG Lu, DAI Jiangping, XIE Ziii, XIU Xiangqian, ZHAO Hong, CHEN Peng, ZHANG Rong, SHI Yi, HAN Ping, ZHENG Youdou. Effect of Adhesion Layer and Annealing Ambient on the Diffusion in Si/Au Eutectic System[J]. Semiconductor Optoelectronics, 2015, 36(5): 722.