在磨削、研磨和抛光加工过程中产生的微裂纹、划痕、残余应力等亚表面缺陷会导致熔石英元件抗激光损伤能力下降,如何快速、准确地检测亚表面损伤成为光学领域亟待解决的关键问题。采用HF酸蚀刻法、角度抛光法和磁流变斜面抛光法对熔石英元件在研磨加工中产生的亚表面缺陷形貌特征及损伤深度进行了检测和对比分析,结果表明,不同检测方法得到的亚表层损伤深度的检测结果存在一定差异,HF酸蚀刻法检测得到的亚表面损伤深度要比角度抛光法和磁流变斜面抛光法检测结果大一些。且采用的磨粒粒径越大,试件表面及亚表面的脆性断裂现象越严重,亚表面缺陷层深度越大。

Subsurface damage will be generated in grinding, lapping and polishing process, the subsurface defects such as micro cracks, scratches and residual stress will decrease the anti-laser-induced damage ability of fused silica optics. How to quickly and accurately detect subsurface damage becomes a vital problem in the field of optics manufacturing. In this paper, subsurface damage morphology and depths of fused silica optics were detected and analyzed by HF acid etching, taper polishing and MRF slope polishing methods. The results show that there are some differences in the test results of subsurface damage depth by different detection methods, the subsurface damage depths obtained by HF acid etching method are larger than those obtained by taper polishing and MRF slope polishing methods. The larger the abrasive particles are, the more serious the phenomenon of brittle fracture in surface and subsurface will be, and the greater the depth of subsurface defects will be.