强激光与粒子束, 2021, 33 (9): 091003, 网络出版: 2021-10-09  

超声振动对于激光烧蚀铝表面温度场仿真分析

Simulation analysis of ultrasonic vibration for laser ablation of aluminum surface temperature field
作者单位
1 天津科技大学 机械工程学院,天津 300222
2 天津市轻工与食品工程机械装备集成设计与在线监控重点实验室,天津 300222
3 天津航天机电设备研究所,天津 300301
摘要
针对超声振动对于激光烧蚀铝表面温度场的影响,建立了三维数值模型,利用ANSYS软件对超声振动辅助激光烧蚀金属铝的温度场进行了数值模拟。通过对比不同激光扫描速度、超声振动频率下激光相邻两个光斑温度场随时间的变化,发现相邻光斑的温度、尺寸以及位置均发生改变。数值研究表明,随着激光扫描速度的增加,激光扫描到相同位置的最大温度降低,而且凹坑的深度逐渐变浅;由于超声振动引起的介质分子位移,当超声振动频率为15 kHz时,凹坑温度发生了明显的下降且凹坑位置在振动方向发生了错位,这有利于产生新的激光作用轨迹。
Abstract
In view of the influence of ultrasonic vibration on the temperature field of laser ablation of aluminum surface, a three-dimensional numerical model was established, and the temperature field of ultrasonic vibration assisted laser ablation of metal aluminum was numerically simulated by using ANSYS software. By comparing the change of temperature field of two adjacent spots with time under different laser scanning speed and ultrasonic vibration frequency, it is found that the temperature, size and position of adjacent spots all change. The numerical results show that with the increase of laser scanning speed, the maximum temperature of laser scanning to the same position decreases, and the depth of craters becomes shallow. Due to the displacement of medium molecules caused by ultrasonic vibration, when the ultrasonic vibration frequency is 15 kHz, the temperature of the crater decreases significantly and the crater position is misplaced in the direction of vibration, which is conducive to the generation of a new laser action trajectory. These experimental results have a certain guiding effect on the design of ultrasonic vibration assisted laser control parameters.

王岩, 殷杰, 董颖怀, 李跃华, 程子政, 赵静楠, 杨硕. 超声振动对于激光烧蚀铝表面温度场仿真分析[J]. 强激光与粒子束, 2021, 33(9): 091003. Yan Wang, Jie Yin, Yinghuai Dong, Yuehua Li, Zizheng Cheng, Jingnan Zhao, Shuo Yang. Simulation analysis of ultrasonic vibration for laser ablation of aluminum surface temperature field[J]. High Power Laser and Particle Beams, 2021, 33(9): 091003.

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