微电子学, 2023, 53 (2): 295, 网络出版: 2023-12-15  

柔性压力传感器成型技术及制备工艺研究进展

Research Progress of Flexible Pressure Sensor’s Molding Technologies and Preparation Processes
作者单位
1 南京邮电大学 集成电路科学与工程学院, 南京 210023
2 南京邮电大学 射频集成与微组装技术国家地方联合工程实验室, 南京 210023
摘要
应用日益广泛的可穿戴设备要求其中的传感器件可拉伸、可弯曲,因此柔性传感器已受到人们的重视。文章对柔性压力传感器的微结构、材料、制备工艺等方面进行了综述,重点总结了现阶段柔性传感器所采用的各种结构,比较了天然微结构、仿生表面微结构、多孔结构、多级结构、多层结构柔性压力传感器的重要性能。介绍了目前常用的柔性基底材料和导电活性材料,对比了光刻技术、3D打印等制造工艺的优缺点,对柔性压力传感器的未来研究方向进行了展望。文章对相关柔性器件的研究具有较高的理论价值和工程参考意义。
Abstract
Wearable devices, which are widely used, require stretchable and bendable sensors, so flexible sensors have received much attention. This paper presents a review of flexible pressure sensors in terms of microstructures, materials, and preparation processes, focusing on summarizing the different structures of flexible sensors at the present stage and comparing the important properties of flexible pressure sensors with natural microstructures, bionic surface microstructures, porous structures, multilevel structures, and multilayer structures. The commonly used flexible substrate materials and conductive active materials are introduced. Comparing the advantages and disadvantages of lithography technology, 3D printing and other manufacturing processes, it is found that the flexible pressure sensor with excellent comprehensive performance and repeatability is more complicated to manufacture and has a higher cost. The future research direction of flexible pressure sensor is prospected. This paper has a high theoretical value and engineering reference significance for related flexible devices.

吴旭鹏, 方玉明, 费宏欣, 蔡滕, 赵江, 李若舟. 柔性压力传感器成型技术及制备工艺研究进展[J]. 微电子学, 2023, 53(2): 295. WU Xupeng, FANG Yuming, FEI Hongxin, CAI Teng, ZHAO Jiang, LI Ruozhou. Research Progress of Flexible Pressure Sensor’s Molding Technologies and Preparation Processes[J]. Microelectronics, 2023, 53(2): 295.

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