光学 精密工程, 2018, 26 (3): 632, 网络出版: 2018-04-25
反应烧结SiC陶瓷脆性去除特征及刻划力波动行为
Removal characteristics and fluctuation behavior of cutting force during scratch process of RB-SiC ceramics
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李志鹏, 张飞虎, 孟彬彬. 反应烧结SiC陶瓷脆性去除特征及刻划力波动行为[J]. 光学 精密工程, 2018, 26(3): 632. LI Zhi-Peng, ZHANG Fei-Hu, Meng Bin-Bin. Removal characteristics and fluctuation behavior of cutting force during scratch process of RB-SiC ceramics[J]. Optics and Precision Engineering, 2018, 26(3): 632.
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