在芯片紧密度、功耗都在增加的微电子封装领域, FBGA封装在同体积下有较大的存储容量。基于有限元和正交法, 进行了FBGA焊点热循环载荷下的可靠性分析, 并进行了更稳健的焊点结构参数优化设计。结果表明, 焊点阵列对FBGA结构热可靠性有重要影响; 优化方案组合为12×12焊点阵列, 焊点径向尺寸为0.42 mm, 焊点高度为0.38 mm, 焊点间距为0.6 mm。经过优化验证, 该优化方案的等效塑性应变范围较原始设计方案降低了89.92%, 信噪比提高到17.72 dB, 实现了焊点参数优化目标。

In the field of microelectronic packaging where the integration and power consumption of chips are increasing, the FBGA package has a larger storage capacity with the same volume. Based on the finite element and orthogonal method, the reliability performance of FBGA solder joints under thermal cycling load was analyzed, and a optimization design with more robust solder joint structural parameters was carried out. The results showed that the solder joint array had an important influence on the thermal reliability of the FBGA structure. The optimized combination scheme was the 12*12 solder joint array, where the radial size of the solder joint was 0.42 mm, the height was 0.38 mm, and the pitch was 0.6 mm. After optimization verification, the optimization scheme reduced the equivalent plastic strain range by 89.92% compared with the original design scheme, and the signal-to-noise ratio was increased to 17.72 dB, having achieved the purpose for optimizing the solder joint parameters.