基于正交法的FBGA焊点可靠性优化研究
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孙勤润, 杨雪霞, 张伟伟, 王超, 刘昭云, 彭银飞. 基于正交法的FBGA焊点可靠性优化研究[J]. 微电子学, 2022, 52(1): 144. SUN Qinrun, YANG Xuexia, ZHANG Weiwei, WANG Chao, LIU Zhaoyun, PENG Yinfei. Research on Optimal FBGA Solder Joints Reliability Based on Orthogonal Method[J]. Microelectronics, 2022, 52(1): 144.