准分子激光脉冲直写刻蚀速率与能量密度的关系
[1] SMUK A Y, LAWANDY N M. Selective etching in laser written semiconductor-doped glasses [J]. Optics Communications , 1998,156: 297-299.
[2] 李凤友,李红军,卢振武,等.激光直写系统焦斑整形的研究[J].光学精密工程,2001,9(1):297-299.LI F Y, LI H J, LU ZH W, et al. Focused spot shaping in laser writing system [J ]. Optics and Precision Engineering, 2001,9 ( 1 ): 297-299. ( in Chinese)
[3] 刘文波.准分子激光微加工的应用研究[D].武汉:武汉工业大学硕士论文,2000.LIU W B. Study of application of micromachining by excimer laser [D]. Wuhan:Wuhan Polytechnology University,2000. (in Chinese)
[4] IHLEMANN J, RRBAHN K. Excimer laser micro machining: fabrication and applications of dielectric masks[J].Applied Surface Science, 2000,587-592.
[5] . Excimer laser micromachining and replication of 3D optical surfaces[J]. Applied Surface Science, 1998,911-914.[6 軴HJI H, FRENCH P J, TSUTSUMI K. Fabrication of mechanical structures in p-type silicon using electrochemical etching[J]. Sensors and Actuators, 2000, 82: 254-258.
魏仁选, 姜德生, 周祖德. 准分子激光脉冲直写刻蚀速率与能量密度的关系[J]. 光学 精密工程, 2004, 12(2): 231. 魏仁选, 姜德生, 周祖德. [J]. Optics and Precision Engineering, 2004, 12(2): 231.