热电式MEMS微波功率传感器的封装研究
[1] REBEIZ G M. RF MEMS: theory, design and technology [M]. Boston: John Wiley & Sons, 2003: 1-20.
[2] YAN J B, LIAO X P. Research on the response time of indirect-heating microwave power sensor [J]. IEEE Sensors J, 2016, 16(13): 5270-5276.
[3] 李龙飞, 胡加杨, 李方清, 等. 电容式微波功率检测系统的灵敏度特性研究 [J]. 微电子学, 2020, 50(3): 433-438.
[4] ZHANG Z, MA Y. DC-25 GHz and low-loss MEMS thermoelectric power sensors with floating thermal slug and reliable back cavity based on GaAs MMIC technology [J]. Micromachines, 2018, 9(4): 154.
[5] CHEN C, LIAO X P, CHU C L, et al. Modeling of MEMS microwave integrated detector applied to 8-12 GHz receiver [J]. Sol Sta Elec, 2019, 160: 107626.1- 107626.8.
[6] LI J H, LIAO X P, CHU C L. A novel thermistor-based RF power sensor with wheatstone bridge fabricating on MEMS membrane [J]. J Microelectromechan Syst, 2020, 29(5): 1314-1321.
[7] JAEGGI D, BALTES H, MOSER D. Thermoelectric AC power sensor by CMOS technology [J]. IEEE Elec Dev Lett, 1992, 13(7): 366-368.
[8] 黄从朝, 黄庆安, 廖小平. 双端加热式微波功率传感器, CN100498348C [P]. 2009-06-10.
[9] 廖小平, 周锐. 一种热隔离式MEMS微波功率传感器, CN103149424B [P]. 2015-05-06.
[10] 戴瑞萍, 胡加杨, 李龙飞, 等. 热电式MEMS微波功率传感器的热学特性研究 [J]. 微电子学, 2019, 49(6): 868-872, 877.
[12] KIM K I, KIM Jungmu, KIM Jongman, et al. Packaging method for RF MEMS devices using LTCC capping substrate and BCB adhesive bonding [C]// Transducers. Seoul, South Korea. 2005: 1092- 1095.
[13] MARGOMENOS A, KATEHI L P B. Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS [J]. IEEE Trans Microw Theo Tech, 2004, 52(6): 1626-1636.
[14] HUA D, TAN J, CAI C. Packaging research for X-band microwave phase detector based on thermoelectric power sensor [C]// IEEE 9th ICCSN. Guangzhou, China. 2017: 737-741.
[15] JOUNG Y H, ALLEN M G. Chip-to-board micromachining for interconnect layer passive components [J]. IEEE Trans Compon Packag Tech, 2007, 30(1): 15-23.
唐蒙, 于文婷, 朱雨澄, 孙丽露, 华睿, 王德波. 热电式MEMS微波功率传感器的封装研究[J]. 微电子学, 2022, 52(4): 635. TANG Meng, YU Wenting, ZHU Yucheng, SUN Lilu, HUA Rui, WANG Debo. Research on Packaging of Thermoelectric MEMS Microwave Power Sensors[J]. Microelectronics, 2022, 52(4): 635.