为了研究不同封装条件对低温共烧陶瓷(LTCC)基板封装焊接后残余热应力的影响, 该文针对不同温变载荷下LTCC基板的热应力变形进行了仿真计算和实验测试, 结果显示仿真计算与实验测试结果具有较好的一致性, 验证了数值仿真用于LTCC基板封装焊接后残余热应力仿真的可行性。在此基础上对零膨胀合金底板和硅铝合金封装条件下3种典型工作温度对应的LTCC基板的热应力进行了仿真计算。结果表明, 封装焊接后LTCC基板两侧边缘应力集中, 中间残余应力小, 呈翘曲状态, 采用硅铝合金封装焊接的热应力小于零膨胀合金封装。

In order to study the effects of different packaging conditions on the residual thermal stresses of low temperature co-fired ceramic (LTCC) substrate after packaging and welding, the thermal stress deformation of LTCC substrate under different temperature variation loads were simulated and tested in this work. The results show that the simulation results are in good agreement with the experimental results, which verified the feasibility of the numerical simulation for simulating the residual thermal stress of LTCC substrate after packaging and welding. On this basis, the simulation calculation of LTCC substrates corresponding to three typical working temperatures under the condition of zero expansion alloy bottom plate and silicon aluminum alloy packaging are carried out. The results show that the stress of LTCC on both sides of the LTCC substrate edge is concentrated and the residual stress in the middle is small, showing a warped state, while the thermal stress with silicon aluminum alloy packaging and welding is less than that of the zero expansion alloy packaging.