聚苯乙烯/六方氮化硼微波复合基板的制备与性能研究

针对高功率器件、高密度封装等微波通信领域对高性能微波复合基板的迫切需求, 该文提出了一种将双螺杆造粒和热压成型结合的新技术, 制备了以高抗冲聚苯乙烯(HIPS)为基体、六方氮化硼(h-BN)陶瓷为填料的高导热微波复合基板, 并对基板的显微结构、热学性能和介电性能进行了全面表征。结果表明, 采用大粒径(25 μm)的h-BN(h-BN25)比小粒径(5 μm)的h-BN(h-BN5)填充后更有利于提高复合基板的热导率(λ), 降低其介电损耗(tan δ)。随着h-BN25质量分数(w(h-BN25))从0增加至70%, HIPS/h-BN25微波复合基板的λ从0.13 W·m-1·K-1提高到7.43 W·m-1·K-1(面内)和2.55 W·m-1·K-1(面间), 分别是纯HIPS的57倍和20倍, 表明采用以上制备技术能实现h-BN在HIPS基体中的定向排列, 构建有效的面内导热网络。同时复合基板的tan δ由7.3×10-4降低至5.3×10-4(10 GHz下), 热膨胀系数α从93.8×10-6/K降至18.7×10-6/K。填充w(h-BN25)=70%的HIPS/ h-BN25微波复合基板综合性能优异, 10 GHz时, 其介电常数εr=3.9, tan δ=5.3×10-4, λ=7.43 W·m-1·K-1, α=18.7×10-6/K, 在微波通信领域具有良好的应用前景。

Abstract

In response to the urgent demand for high performance microwave composite substrates for high power devices, high density packaging and other microwave communication fields, a new technique combining twin-screw pelletizing and hot press molding is proposed to prepare high thermal conductivity microwave composite substrates with high anti-impact polystyrene (HIPS) as the matrix and hexagonal boron nitride (h-BN) ceramics as the filler. The microstructure, microwave dielectric properties and thermal properties of the substrates are fully characterized. The results show that the use of h-BN25 with a large particle size of 25 μm is more beneficial than h-BN5 with a small particle size of 5 μm in improving the thermal conductivity λ and reducing the dielectric loss tan δ. As the filling ratio w of h-BN25 increases from 0 to 70%, the thermal conductivity of the HIPS/ h-BN25 microwave composite substrate increases from 0.13 W·m-1·K-1 to 7.43 W·m-1·K-1(in-plane) and 2.55 W·m-1·K-1 (inter-plane), which are 57 and 20 times higher than that of-pure HIPS, respectively, indicating that the above-mentioned preparation technique can realize the directional arrangement of h-BN in the HIPS matrix and build an effective in-plane thermal conductivity network. Meanwhile, the dielectric loss tan δ of the composite substrate is reduced from 7.3×10-4 to 5.3×10-4 (10 GHz), the coefficient of thermal expansion α is reduced from 93.8×10-6/K to 18.7×10-6/K. The HIPS/ h-BN25 microwave composite substrate filled with 70% of h-BN25 ceramic has excellent comprehensive performance, the thermal conductivity λ=7.43 W·m-1·K-1, dielectric constant εr=3.9, dielectric loss tan δ=5.3×10-4 and the coefficient of thermal expansion α=18.7×10-6/K at 10 GHz, which exhibits good application prospects in the field of microwave communication.

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田星宇, 彭海益, 王晓龙, 方振, 庞利霞, 姚晓刚, 林慧兴. 聚苯乙烯/六方氮化硼微波复合基板的制备与性能研究[J]. 压电与声光, 2022, 44(4): 547. TIAN Xingyu, PENG Haiyi, WANG Xiaolong, FANG Zhen, PANG Lixia, YAO Xiaogang, LIN Huixing. Investigation on Preparation and Properties of Polystyrene/Hexagonal Boron Nitride Microwave Composite Substrates[J]. Piezoelectrics & Acoustooptics, 2022, 44(4): 547.

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