分析了热沉和陶瓷基板对背冷式封装结构半导体激光器阵列性能的影响。通过栅格化厚铜填充技术降低了复合金刚石热沉的等效电阻, 并实现了热膨胀系数匹配; 采用热沉和陶瓷基板嵌入焊接技术, 提高了封装散热能力和稳定性。制作了间距为0.4mm的5Bar条芯片阵列样品, 在70℃热沉温度、200A工作电流(占空比为1%)条件下进行性能测试, 结果显示器件输出功率为1065W、电光转换效率为59.2%。在高温大电流条件下进行了1824h寿命试验, 器件表现出良好的可靠性。

The influence of heat sink and ceramic substrate on the performance of semiconductor laser array with back-cooled packaging structure was analyzed. The equivalent resistance of the heat sink of composite diamond was reduced and the matching of thermal expansion coefficient was realized by rasterized thick copper filling technology. Using heat sink and ceramic substrate embedded welding technology, the heat dissipation ability and stability of the packaging structure was improved. Then the sample of 5Bar chip array with 0.4mm spacing was fabricated, and test results indicate that at 70℃, 200A and 1% duty cycle, the output power and the electro-optic conversion efficiency can reach 1065W and 59.2%, respectively. The sample shows good reliability in the 1824hours life test under high temperature and high current.