压电与声光, 2023, 45 (5): 682, 网络出版: 2024-01-06
声表面波器件引线楔形键合跟部微损伤控制研究
Research of Heel Micro-crack Control of Wire Wedge Bonding in Surface Acoustic Wave Devcies
摘要
声表面波器件内连的主流工艺是硅铝丝超声键合,而跟部微损伤是该工艺最大的质量隐患。该文从超声键合原理和工艺技术出发,对造成跟部微损伤的影响因素进行了分析,并给出了相应的解决方案。该方案使声表面波器件的键合点跟部微损伤得到有效控制。
Abstract
The mainstream process for inter-connecting SAW devices is AlSi wire ultrasonic bonding, and the heel micro-crack is the biggest quality hazard of this process. According to principle and process of ultrasonic bonding,the factors causing the heel micro-crack are analyzed in this paper, and the corresponding solution is given. The proposed scheme can effectively control the heel micro-crack at the bonding points of SAW devices.
吴燕, 柳怡, 王岚, 唐运红, 周琴珍. 声表面波器件引线楔形键合跟部微损伤控制研究[J]. 压电与声光, 2023, 45(5): 682. WU Yan, LIU Yi, WANG Lan, TANG Yunhong, ZHOU Qinzhen. Research of Heel Micro-crack Control of Wire Wedge Bonding in Surface Acoustic Wave Devcies[J]. Piezoelectrics & Acoustooptics, 2023, 45(5): 682.