凹槽型微通道传热与流动性能的数值分析
[1] Tuckerman D B, Pease R F W. High-performance heat sinking for VLSI[J]. Electron Device Lett., 1981, 2(5): 126-129.
[2] Izci T, Koz M, Kosar A. The effect of micro pin-fin shape on thermal and hydraulic performance of micro pin-fin heatsinks[J]. Heat Transf. Eng., 2015, 36(17): 1447-1457.
[3] 彭洁旻, 陈 维, 邓大祥. 内凹形微通道热沉换热流动性能的数值分析[J]. 半导体光电, 2014, 35(2): 88-92.
Peng Jiewen, Chen Wei, Deng Daxiang. Numerical analysis on heat transfer and flow characteristics of cooper[J]. Semiconductor Optoelectronics, 2014, 35(2): 88-92.
[4] Hung T C, Yan W M. Effects of tapered-channel design on thermal performance of microchannel heat sink[J]. Int. Commun. Heat Mass Transf., 2012, 39(9): 1342-1347.
[5] Naphon P, Klangchart S. Effects of outlet port positions on the jet impingement heat transfer characteristics in the mini-fin heat sink[J]. Int. Commun. Heat Mass Transf., 2011, 38(10): 1400-1405.
[6] Tang S, Zhao Y H, Diao Y H, et al. Effects of various inlet/outlet positions and header forms on flow distribution and thermal performance in microchannel heat sink[J]. Microsyst. Technol., 2018, 24(5): 2485-2497.
[7] 夏国栋, 李云飞, 翟玉玲, 等. 变截面微通道散热器流动和传热特性[J]. 北京工业大学学报, 2015, 41(2): 287-292.
Xia Guodong, Li Yunfei, Zhai Yuling, et al. Fluid flow and heat transfer on microchannel heat sink with changeable cross-sections[J]. J. of Beijing University of Technol., 2015, 41(2): 287-292.
[8] Wang Y B, Kai Z, Zhuo C, et al. Effects of the location of the inlet and outlet on heat transfer performance in pin fin CPU heat sink[J]. Appl. Thermal Eng., 2019, 151: 506-513.
范贤光, 黄江尧, 许英杰. 凹槽型微通道传热与流动性能的数值分析[J]. 半导体光电, 2020, 41(2): 232. FAN Xianguang, HUANG Jiangyao, XU Yingjie. Numerical Analysis on Heat Transfer and Flow Characteristics of Grooved Microchannel[J]. Semiconductor Optoelectronics, 2020, 41(2): 232.