Ex situ characterization techniques in molecular beam epitaxy (MBE) have inherent limitations, such as being prone to sample contamination and unstable surfaces during sample transfer from the MBE chamber. In recent years, the need for improved accuracy and reliability in measurement has driven the increasing adoption of in situ characterization techniques. These techniques, such as reflection high-energy electron diffraction, scanning tunneling microscopy, and X-ray photoelectron spectroscopy, allow direct observation of film growth processes in real time without exposing the sample to air, hence offering insights into the growth mechanisms of epitaxial films with controlled properties. By combining multiple in situ characterization techniques with MBE, researchers can better understand film growth processes, realizing novel materials with customized properties and extensive applications. This review aims to overview the benefits and achievements of in situ characterization techniques in MBE and their applications for material science research. In addition, through further analysis of these techniques regarding their challenges and potential solutions, particularly highlighting the assistance of machine learning to correlate in situ characterization with other material information, we hope to provide a guideline for future efforts in the development of novel monitoring and control schemes for MBE growth processes with improved material properties.

We introduce a novel method to create mid-infrared (MIR) thermal emitters using fully epitaxial, metal-free structures. Through the strategic use of epsilon-near-zero (ENZ) thin films in InAs layers, we achieve a narrow-band, wide-angle, and p-polarized thermal emission spectra. This approach, employing molecular beam epitaxy, circumvents the complexities associated with current layered structures and yields temperature-resistant emission wavelengths. Our findings contribute a promising route towards simpler, more efficient MIR optoelectronic devices.

The InGaN films and GaN/InGaN/GaN tunnel junctions (TJs) were grown on GaN templates with plasma-assisted molecular beam epitaxy. As the In content increases, the quality of InGaN films grown on GaN templates decreases and the surface roughness of the samples increases. V-pits and trench defects were not found in the AFM images. p⁺⁺-GaN/InGaN/n⁺⁺-GaN TJs were investigated for various In content, InGaN thicknesses and doping concentration in the InGaN insert layer. The InGaN insert layer can promote good interband tunneling in GaN/InGaN/GaN TJ and significantly reduce operating voltage when doping is sufficiently high. The current density increases with increasing In content for the 3 nm InGaN insert layer, which is achieved by reducing the depletion zone width and the height of the potential barrier. At a forward current density of 500 A/cm², the measured voltage was 4.31 V and the differential resistance was measured to be 3.75 × 10^?3 Ω·cm² for the device with a 3 nm p⁺⁺-In_0.35Ga_0.65N insert layer. When the thickness of the In_0.35Ga_0.65N layer is closer to the “balanced” thickness, the TJ current density is higher. If the thickness is too high or too low, the width of the depletion zone will increase and the current density will decrease. The undoped InGaN layer has a better performance than n-type doping in the TJ. Polarization-engineered tunnel junctions can enhance the functionality and performance of electronic and optoelectronic devices.

(Ga,Fe)Sb is a promising magnetic semiconductor (MS) for spintronic applications because its Curie temperature (T_C) is above 300 K when the Fe concentration is higher than 20%. However, the anisotropy constant K_u of (Ga,Fe)Sb is below 7.6 × 10³ erg/cm³ when Fe concentration is lower than 30%, which is one order of magnitude lower than that of (Ga,Mn)As. To address this issue, we grew Ga_1-x-yFe_xNi_ySb films with almost the same x (≈24%) and different y to characterize their magnetic and electrical transport properties. We found that the magnetic anisotropy of Ga_0.76-yFe_0.24Ni_ySb can be enhanced by increasing y, in which K_u is negligible at y = 1.7% but increases to 3.8 × 10⁵ erg/cm³ at y = 6.1% (T_C = 354 K). In addition, the hole mobility (μ) of Ga_1-x-yFe_xNi_ySb reaches 31.3 cm²/(V?s) at x = 23.7%, y = 1.7% (T_C = 319 K), which is much higher than the mobility of Ga_1-xFe_xSb at x = 25.2% (μ = 6.2 cm²/(V?s)). Our results provide useful information for enhancing the magnetic anisotropy and hole mobility of (Ga,Fe)Sb by using Ni co-doping.

InP基InGaAs/InP雪崩光电二极管（APD）对近红外光具有高敏感度，使其成为微弱信号和单光子探测的理想光电器件。然而随着先进器件结构越来越复杂，厚度尺寸从量子点到几微米不等，性能越来越受材料中晶格缺陷的影响和工艺条件的制约。采用固态源分子束外延（MBE）技术分别在As和P气氛保护下对InP衬底进行脱氧处理并外延生长晶格匹配的In0.53Ga0.47As薄膜和APD结构材料。实验结果表明，As脱氧在MBE材料质量方面比P脱氧具有明显的优势，可获得陡直明锐的异质结界面，降低载流子浓度，提高霍尔迁移率，延长少子寿命，并抑制器件中点缺陷或杂质缺陷引起的暗电流。因此，As脱氧可以有效提高MBE材料的质量，这项工作优化了InP衬底InGaAs/InP外延生长参数和器件制造条件。

本文利用分子束外延技术在GaAs（211）B衬底上外延CdTe（211）薄膜，系统研究不同工艺条件对CdTe 外延薄膜的表面形貌和光学性质的影响。研究表明，在一定的生长温度下，在Te气氛下生长CdTe薄膜，增加CdTe：Te的束流比，可显著降低CdTe表面金字塔缺陷的尺寸和密度，当CdTe 和Te束流比为6.5时，金字塔缺陷几乎消失，材料的表面平整度显著改善，X射线衍射（XRD）也表明CdTe晶体质量显著提高。进一步的拉曼光谱表明，随着CdTe和Te束流比的增加，Te的A₁峰减弱，CdTe LO和TO声子峰强度比增强。低温光致发光光谱（PL）研究也表明随着CdTe和Te束流比的增加，Cd空位的减少可以使与杂质能级相关的深能级区域的峰强降低，与此同时和晶体质量相关的自由激子峰半峰宽减少，材料的光学质量明显改善。该研究为探索CdTe/GaAs外延材料的理想的工艺窗口以及相关机理，并为进一步以此为缓冲层外延高质量HgCdTe材料提供基础。

为了提高红外探测器的工作温度，基于InAs/GaSb II类超晶格材料设计了一种五级带间级联结构中波红外光电探测器，并采用分子束外延技术和标准化光刻及刻蚀技术进行了器件的制备。在77 K时，该器件的50%截止波长是4.02 μm，在0 V时峰值探测率为1.26×10¹² cm·Hz^1/2/W；在300 K零偏压下，该器件的50%截止波长是4.88 μm，峰值探测率为1.28×10⁹ cm·Hz^1/2/W，实现了高温探测。从180 K到300 K，器件的暗电流主要由扩散电流主导。在77 K到220 K温度范围的暗电流曲线中观察到了负微分电阻现象，并解释了峰谷电流比相对于温度变化的趋势。研究结果表明，具有带间级联结构的T2SL探测器可以进行室温工作，在中波范围内有比较明显的优势。