在新一代高速无线通信技术推动下, 低温共烧陶瓷技术(LTCC)正处于重大变革时期。采用低介电常数(K)、低损耗、谐振频率温度稳定型LTCC作为高频基板材料, 可以满足无线技术高速率、低延时、高可靠的需求, 是当前热点研究之一。因此商用基板材料的现状和一些候选材料的研究工作被主要评述, 重点对玻璃/陶瓷体系、氧化物助烧体系、氟化物助烧体系、本征低温烧结体系等低K值LTCC材料的组成、结构特征、介电性能、热膨胀系数等具体指标及相应优缺点进行了讨论。同时介绍了一些热门体系的改性工作及其毫米波适用性, 最后对未来低K值LTCC材料的发展进行展望。

With the development of a high-speed wireless technology, low-temperature co-fired ceramics (LTCC) technology becomes popular. The high-speed, low-delay and high-reliable wireless transmission could be achieved by using LTCC substrates with a low-permittivity (K), a low-loss and a stable-temperature of resonant frequency, as one of functional materials. This review introduced the current situation of commercial substrate materials and alternative LTCCs reported, i.e., ceramic/glass, oxide-assisted sintering, fluoride-assisted sintering and intrinsic low-sintering ceramic systems. The composition, structural characteristics, dielectric properties, coefficient of thermal expansion of low-K LTCCs, as well as the advantages and disadvantages, were also discussed. Some studies of commercial substrates were further described, and their performances in millimeter-wave application were represented. In addition, the development trend of low-K LTCCs was also proposed.